Trimble $900 million 4.15%, 4.9% notes issue

15/6/2018
Investment grade bond/note issue

$ 900 million

Announced

15/6/2018


Overview:

  • The issue consists of $300 million 4.15% notes due 2023 and $600 million 4.9% notes due 2028.

Mihail Georgiev - Data analyst

Jurisdiction:

United States

Deal type:

Investment grade bond/note issue

Practice area:

Capital markets : Debt

Governing law:

United States

Industry sector:

Technology and telecommunications


Firm:

Party: JPMorgan Securities (Underwriter)

Party: Bank of America Merrill Lynch (Underwriter)

Party: Goldman Sachs (Underwriter)

Party: Scotiabank (Underwriter)

Party: Wells Fargo Securities (Underwriter)