IFLR1000

Reliance Industries $225 million 2.512% notes issue

1/8/2015
High-yield bond/note issue
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$ 225 million

Completed

1/8/2015

Overview:

  • Reliance Industries has issued $225 million in senior notes.
  • The 2.512% notes are due in 2026.
  • JPMorgan acted as underwriter.

Katrin Kostadinova - Data analyst

Jurisdiction:

India

Deal type:

High-yield bond/note issue

Practice area:

Capital markets : Debt

Governing law:

India

Industry sector:

Financial services

Firms:
A&O Shearman

Party: JPMorgan Chase (Underwriter)

Juris Corp

Party: Reliance Industries (Issuer)

Milbank

Party: Reliance Industries (Issuer)

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